ABOUT THE GEN-Z CONSORTIUM
Gen-Z: An open systems Interconnect designed to provide memory-semantic access to data and devices via direct-attached, switched or fabric topologies.
The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The consortium’s 12 initial members are AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx. Membership is expanding daily, as reflected on our member list.
THE LATEST FROM GEN-Z
SEE WHAT OUR MEMBERS HAVE TO SAY
“2018 will provide a new era of opportunities, where data centers must make decisions in memory to respond quickly to the sheer volume of data being created and analyzed. The Gen-Z Specification provides a flexible foundation for customers to address near-term data opportunities like these and make the most of new memory technologies.” – Malcolm… Read More »
“Today’s hyperconnected world demands new levels of performance and scalability to analyze and process vast amounts of data in real-time. Open standards, such as Gen-Z, are key to delivering the compute and storage infrastructure solutions required to address this challenge.” – Drew Henry, senior vice president and general manager, Infrastructure Business Unit, Arm
“The public release of the Gen-Z Core Specification 1.0 is a significant milestone to enable an open ecosystem of innovation in computing devices of every size, from the IoT edge to data centers to supercomputing. As one of the founding Gen-Z Consortium members, Hewlett Packard Enterprise will leverage Gen-Z’s fabric technology to advance HPE’s Memory-Driven… Read More »
“The release of the Gen-Z Consortium’s core specification V1.0 is a major milestone for enabling new innovation for in the compute and IT market segments. Avery is well positioned with its expertise in verification IP (VIP) to meet the needs and development efforts based on the 1.0 specification. Avery will be providing the Gen-Z development… Read More »
“Persistent memory technologies will radically redefine how we harness and understand the rapidly increasing volume and velocity of mass data, and enable us to realize new data possibilities across a broad range of Big Data and Fast Data applications. On-going collaboration with ecosystem partners and customers to establish standardized interfaces for CPUs and emerging memories,… Read More »
“The Gen-Z Core Specification 1.0 release will enable the first commercial products for memory-centric architectures. These solutions will deliver improved efficiency and performance for a wide variety of applications including in-memory databases, real-time analytics, high performance computing, and artificial intelligence. The broad coalition of Gen-Z members signals the strong commitment of both suppliers and customers… Read More »
“As one of the founding members of the Gen-Z Consortium, SK hynix truly welcomes the completion of Gen-Z Core Spec 1.0. Now that the essential spec work is complete and several customers endorse Gen-Z, there will be more opportunities to develop emerging memory solutions that can enable more scalable memory systems in the next decade.”… Read More »
“The Gen-Z Consortium fosters eco-system discussions and developments of higher performance and richer capabilities for future data center connectivity. The release of the 1.0 Gen-Z Specification is a major milestone, which will enable companies and organizations to move into next level of implementations.” – Gilad Shainer, vice president of marketing at Mellanox Technologies
“The release of core specification 1.0 today is a significant step towards realization of new architectures and evolution of existing technologies to expand into new roles. Samsung is excited to be a member of the Gen-Z Consortium and is committed towards industry open standards.” – Harry Yoon, Vice President of Memory Product Planning & Application… Read More »
“The release of the Gen-Z Core Specification 1.0 will kick start Gen-Z product development in earnest and IntelliProp is developing both IP Cores and ASSP product solutions. IntelliProp will release a full package of Gen-Z IP Cores, including Requester/Responder, that will support Rev 1.0 of the specification in the first quarter of 2018, for both… Read More »
“Gen-Z addresses the broad need for a memory-semantic fabric that will enable new use cases and innovative system designs. We congratulate the Gen-Z Consortium in accomplishing this significant milestone that paves the way for product development.” – Manish Muthal, vice president datacenter markets, Xilinx, Inc.
“Dell EMC is very encouraged to see Gen-Z Consortium’s release of their 1.0 spec. The application of Gen-Z in key workloads like Machine Learning, Data Analytics, and In-Memory Computing show that it is a critical part of the future of enterprise system architecture. When you couple this with the fact that it is an open… Read More »
“AMD joins the other members of the Gen-Z Consortium in celebrating the release of the Gen-Z Gen 1.0 open standard for high-performance, cross platform interconnect technology. Low-latency access to memory and storage in the datacenter is an area of pressing need for open ecosystems and technology development. With this significant step, Gen-Z has defined an… Read More »