Flash Memory Summit 2018 is in the books, and the Gen-Z Consortium’s second appearance at the event was a success. The annual conference showcasing new and emerging Flash Memory technologies and applications took place on Aug. 7-9 in Santa Clara, CA. “FMS was a great forum for Gen-Z to show how it plays in the future of the data center,” said … [Read more...]
Gen-Z Consortium makes a splash at FMS 2018
Meeting customer demands with PECFF
PECFF (PCIe® Enclosure Compatible Form Factor) is a new mechanical form factor developed by Gen-Z members to meet new and future customer demands and to reduce solution cost and complexity. PECFF is mechanically compatible with enclosures that support the PCIe CEM AIC (Add-in Card). PECFF is intentionally not compatible with PCIe CEM connectors to … [Read more...]
Gen-Z Scalable Connector – A high-volume universal connector
Gen-Z Consortium members set out to develop a high-volume universal connector capable of spanning multiple market segments. In keeping with its goal of establishing an open ecosystem, in June 2017, the Gen-Z Consortium publicly released a draft specification detailing the connector’s numerous applications including memory, storage, I/O, cabling, … [Read more...]
Flash Memory Summit – August 2018 – Santa Clara
The Gen-Z Consortium is excited to be showing its multi-vendor technology demo at Flash Memory Summit 2018, August 7-9 in Santa Clara. Be sure to visit us in booth #739 to view the demonstration of Gen-Z technology. Gen-Z will also be speaking during the proceedings and participating in a panel on "far-out" flash memory applications and a Chat … [Read more...]
Gen-Z + DDR: A winning combination
Multiple industry-leading processors contain integrated memory controllers that support up to 8 DDR (double data rate) channels. Processors that support 8 DDR 3200 MT/s channels can deliver approximately 200 GB/s of application memory bandwidth. Future processors that support 8 DDR 6400 MT/s channels will deliver approximately 400 GB/s of … [Read more...]
