Member company developments are essential to the continued success of the Gen-Z Consortium and technology, so we were very excited to learn about two announcements taking place at Flash Memory Summit this week.
First ever Gen-Z Protocol Analyzer and Jammer released by Teledyne LeCroy
Gen-Z Consortium member Teledyne LeCroy announced the release of the industry’s first Gen-Z protocol analyzer and jammer at FMS this week. The Summit™ M5x is the first platform to support the Gen-Z Physical Layer Specification 1.0 and can modify, replace, insert, or delete traffic between a Gen-Z requester and responder, verifying adherence to design specifications and identifying potential errors in protocol behavior. It is also the first protocol analyzer to introduce jamming capabilities for Gen-Z protocol. Specifically, the Summit M5x jams transmissions between the Gen-Z requester and responder while remaining within normal operating specifications.
Consortium President Kurtis Bowman stated in Teledyne LeCroy’s press release: “Efficient testing and validation of Gen-Z devices is essential for successful ecosystem development. Protocol Analyzer and Jammer tools from companies like Teledyne LeCroy are a vital part of the process. We are very happy that test and measurement companies like Teledyne LeCroy are so closely involved at this stage of Gen-Z technology advancement.”
For more information, read the press release here.
SMART demos new 3.0” 256GB Gen-Z Memory Module
Consortium member company SMART Modular Technologies, Inc., produces specialty memory, storage, and hybrid solutions; including memory modules, flash memory cards and other solid-state storage products. At FMS this week, SMART announced the demonstration of its new 3.0” 256GB Gen-Z Memory Module (ZMM) which is being shown in the Gen-Z Consortium booth.
The newest 3.0” 256GB DDR4 ZMM supports multiple access semantics, byte and block addressable DRAM access, in-band configuration, and access key/region key memory isolation opcodes. The 3.0” form factor follows the industry-standard enterprise and datacenter SSD 3” form factor from SNIA (4C SFF-TA-1008/9).
“SMART’s dedication to the Consortium has been invaluable,” said Kurtis Bowman, president of the Gen-Z Consortium. “Solutions like the 256GB Gen-Z Memory Module (ZMM) represent important advancement for the industry ecosystem and encourage the adoption of Gen-Z technology. We look forward to future product developments from SMART and other Consortium members.”
SMART’s 256GB ZMM supports 30GB/s of data bandwidth with 400ns deterministic access latency running in Hewlett Packard Enterprise and Dell Gen-Z’s proof of concept demo enabled rack servers while the DDR4 256GB ZMM uses a Gen-Z DRAM Memory Controller ASSP developed by IntelliProp and a high-density DDR4 3DS 64Gb DRAMs provided by Samsung.
For more information, view the press release here.
We will have more updates following this year’s FMS event, so stay tuned to our blog for more news from Gen-Z and our take on the Summit.