Gen-Z Consortium Showcases World’s First Gen-Z Multi-Vendor Technology Demonstration for Memory-Centric Computing
Gen-Z architecture aims at reducing load on CPU, by using the Gen-Z scalable high performance, low latency, memory-semantic fabric technology that can be used to communicate to every device in the system by simplifying data access at rack scale,” said Gopal Hegde, VP/GM Data Center Processor Group, Cavium. “Cavium along with its partners was one of the first to demonstrate an early implementation of the Gen-Z interconnect on its ThunderX2 ARM server. The high performance memory semantic fabric addresses the challenges of explosive data growth by providing a peer to peer interconnect, which is designed to access large volume of data while lowering overall cost & avoiding bottle necks thereby meeting the needs of advanced workloads & real time analytics.”
“I’m very encouraged with the progress the Gen-Z Consortium has made in less than a year. The multi-vender demo and new 112GT/s connector shows the power of collaboration of the best minds in the industry to accelerate innovation in computing platforms,” said Robert Hormuth, Dell EMC Server CTO.
“The consortium has doubled its diverse member base since our formation only eight months ago, evidence of strong industry support for collaboratively advancing open standards to address industry challenges,” said Keith McAuliffe, VP & Chief Technologist at Hewlett Packard Enterprise. “We’re proud of what we’re accomplishing together, demonstrating Gen-Z in action and publishing multiple open specifications to move the industry forward.”
“This demonstration represents another big step in the emergence of Gen-Z as a unified, rack-scale interconnect for memory, storage and compute in tomorrow’s data center,” said Sean Fan, Senior Vice President of IDT’s Computing and Communications Group. “By bringing an open standard approach to new computing models such as memory and storage pooling, the Gen-Z Consortium is enabling a new era of data movement and processing.”
“IntelliProp is very excited to be part of the Gen-Z Consortium and to be participating with a demo of our Gen-Z Persistent Memory Controller at Flash Memory Summit. Gen-Z is poised to provide industry changing performance for enterprise and memory centric compute applications.”
– Hiren Patel, VP Business Development, IntelliProp Inc.
“The growing demands for faster data analysis mandates technology innovations and collaborations around open standards, to deliver the needed compute and storage infrastructures today and in the future,” Said Gilad Shainer, vice president of marketing at Mellanox Technologies. “The collaboration among companies within the Gen-Z Consortium will enable tighter technology development, and the design of efficient data centers in the future.”
“High-performance computing is reaching a critical inflection point. The growth of applications and devices that can harvest and use millions of points of information per day are creating an explosion in data. Making this data available and useful is critical to everything from business manufacturing processes to scientific research,” said Ryan Baxter, director of marketing for Micron’s Compute and Networking Business Unit. “Open memory standards like Gen-Z are a recognition that the pathways that high-performance compute uses to access memory must evolve to deliver the next generation of computing performance.”
“Data center machine learning and analytic workloads require ever greater scalability performance from computing, memory and storage infrastructure solutions. Gen-Z enables memory to scale with CPU performance, allows for a new level of resource pooling efficiency and will unleash the full potential of emerging storage class memory technology. Microsemi endorses the open Gen-Z standard and the industry wide innovation it can deliver. Our portfolio of fabric, data protection and security technologies positions Microsemi well to deliver Gen-Z product solutions.”
– Pete Hazen, Vice President and General Manager of Microsemi’s Scalable Storage Business Unit
“Since being launched at the end of last year, the Gen-Z Consortium has made considerable progress with releases of core, connector and mechanical specifications,” said Chiwook Kim, Vice President of Memory Product Planning & Application Engineering Team at Samsung Electronics. “The demo at FMS’17 marks a major milestone towards a memory semantics fabric that will meet the requirements of new and existing computing workloads. Samsung is delighted to be part of the Consortium and its concerted efforts to establish an open industry standard.”
“In pursuit of enabling future memory technologies including storage class memory, SK hynix fully supports open standards like Gen-Z. Gen-Z introduces new opportunities to innovate memory system architecture and contribute to better scalable memory solutions.”
– Sunny Khang, Vice President, Head of DRAM Product Planning & Enabling Office, SK hynix Inc.
“Our designs always strive to create real value for our customers. In this case “value” means significantly increasing architectural design flexibility by extending the distance high data rate signals can travel at a much lower system cost,” said Phil Gilchrist, CTO of Data and Devices at TE Connectivity. “Sliver is a highly versatile platform of connectors and cables that dramatically simplifies the way most components will connect, thereby reducing design risk and supply chain complexity for leading customers, and we are very pleased that COBO and Gen-Z have adopted it as a standard.”
“Persistent memory technologies promise to unlock huge new possibilities for managing mass data, particularly as it relates to in-memory databases, big data analytics and machine learning. Western Digital’s work with the Gen-Z Consortium, including the presentation of a first-of-its kind memory-centric technology demonstration at the Flash Memory Summit this week and collaboration with our ecosystem partners and customers to establish open standards for emerging technologies, underscores our ongoing commitment to driving the future of persistent memory.”
– Martin Fink, Executive Vice President and Chief Technology Officer for Western Digital Corporation
“Xilinx is committed to open standards and GenZ is well positioned to address the convergence of memory and storage,” said Manish Muthal, Vice President, Data Center Business at Xilinx. “Xilinx products are used throughout the GenZ technology showcase at FMS, illustrating the capabilities of our All Programmable devices in modern data center architectures.”