Traditional Data Processing at a Crossroads The exponential growth of data and the need to quickly process and act on the information provided is stretching traditional computing infrastructures beyond their limits. As a result, enterprises are struggling to keep up and meet the customer demand for improved performance, functionality and … [Read more...]
Gen-Z Innovates With Multi-Box Scaling
Read the latest Gen-Z white paper: Highly Resilient 25G Gen-Z PHY
The Gen-Z Consortium has released a suite of nine final specifications that enables designers to begin the development of products utilizing Gen-Z technology solutions. Our latest white paper takes a deeper dive into the Gen-Z Physical Layer Specification. To maximize system design flexibility, the Gen-Z Physical Layer Specification does not … [Read more...]
Gen-Z ecosystem expands with new technology solutions
With the massive amount of data being processed in data centers and at the edge, the need for a new interconnect has become crucial. Existing server architectures scale the amount of available dynamic RAM (DRAM) by the number of double data rate (DDR) slots in the server. Furthermore, since that DRAM is locked into a specific server, existing … [Read more...]
Meeting customer demands with PECFF
PECFF (PCIe® Enclosure Compatible Form Factor) is a new mechanical form factor developed by Gen-Z members to meet new and future customer demands and to reduce solution cost and complexity. PECFF is mechanically compatible with enclosures that support the PCIe CEM AIC (Add-in Card). PECFF is intentionally not compatible with PCIe CEM connectors to … [Read more...]
