The Gen-Z Consortium has released a suite of nine final specifications that enables designers to begin the development of products utilizing Gen-Z technology solutions. Our latest white paper takes a deeper dive into the Gen-Z Physical Layer Specification.To maximize system design flexibility, the Gen-Z Physical Layer Specification does not … [Read more...]
Read the latest Gen-Z white paper: Highly Resilient 25G Gen-Z PHY
Gen-Z ecosystem expands with new technology solutions
With the massive amount of data being processed in data centers and at the edge, the need for a new interconnect has become crucial. Existing server architectures scale the amount of available dynamic RAM (DRAM) by the number of double data rate (DDR) slots in the server. Furthermore, since that DRAM is locked into a specific server, existing … [Read more...]
Meeting customer demands with PECFF
PECFF (PCIe® Enclosure Compatible Form Factor) is a new mechanical form factor developed by Gen-Z members to meet new and future customer demands and to reduce solution cost and complexity. PECFF is mechanically compatible with enclosures that support the PCIe CEM AIC (Add-in Card). PECFF is intentionally not compatible with PCIe CEM connectors to … [Read more...]
